CVE-2023-33063: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
| Vendor | Qualcomm |
|---|---|
| Product | Multiple Chipsets |
| Date added to KEV | 2023-12-05 |
| Due date (BOD 22-01) | 2023-12-26 |
| Known ransomware campaign use | Unknown |
| CWE | CWE-416 |
| Required action | Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable. |
What to do
- Identify every instance of Qualcomm Multiple Chipsets in your environment (asset inventory, EDR, vulnerability scanner).
- Apply CISA's required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
- Federal civilian agencies must act by 2023-12-26 under BOD 22-01; other organizations can use the same date as a target.
- Check the vendor advisory and NVD entry linked below for affected versions, then record the fix in your change log.
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Sources
- NVD entry for CVE-2023-33063 (severity scores, if any, live there)
- CISA KEV catalog entry
- https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a
- https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110
- https://nvd.nist.gov/vuln/detail/CVE-2023-33063